MPD<0.2 P Grade SiC Wafer Manufacturer

Today, 6-inch conductive SiC wafers are the mainstream size product in the industry. HMT P grade SiC Wafers have reached international standards in quality and have a very high cost-effectiveness.We cooperated with domestic and abroad semiconductor companies and reseach labs many years. 

HMT's P-Grade SiC Wafers deliver:
✅ MPD <0.2 cm⁻² - Exceeds SEMI standards
✅ Certified Cost-Performance: 30% lower cost vs. peers at equivalent quality
✅ Process-Optimized Geometry:
・TTV ≤ 10μm | LTV ≤ 5μm
・Warp ≤ 15μm | Ra ≤ 0.2nm

 
Size evolution of SiC Wafer

The size of the SiC substrate (calculated by diameter) is mainly 2 inches (50mm), 3 inches (75mm), 4 inches (100mm), 6 inches (150mm), 8 inches (200mm) and other specifications. SiC substrate is constantly developing in the direction of large size, and the main mass production product sizes in the industry are concentrated in 6 inches and 8 inches. HMT company already mass-produced 8-inch SiC Wafer products.

In order to improve production efficiency and reduce cost, large size is an important development direction of SiC substrate preparation technology. The larger the substrate size, the more chips can be manufactured per unit substrate, and the lower the unit chip cost. The larger the size of the substrate, the smaller the waste on the edge, which is conducive to further reducing the cost of the chip.

In the semi-insulated SiC market, the current mainstream substrate product specification is 4 inches. In the conductive SiC market, the current mainstream substrate product specification is 6 inches.

SiC Wafer Applications