Home >> Products >> SiC Boule/ SiC Ingot
HMT offers high quality D/Dummy Grade and R/Research Grade for laser stealth dicing/sawing machine testing. The current market standard for SiC ingot ...
HMT offers guaranteed 6-inch SiC boule for laser cutting machine testing. The current market standard for SiC ingot is 6 inches in diameter. We provide both conductive N-type and semi-insulating SI-type boules at competitive prices with high quality. The average thickness of our SiC boules ranges from 10 to 20mm. Please feel free to contact us for SiC Boule quotation.
As the third generation semiconductor material, silicon carbide compared with silicon materials, with large band gap width, high breakdown electric field, high saturated electron drift speed, high thermal conductivity, high radiation resistance and other characteristics, suitable for manufacturing high temperature, high pressure, high frequency, high power devices.
SiC wide energy Gap (Band Gap) than the existing Si (silicon) Gap width more than 3 times wider, can withstand more than 10 times the voltage, SiC low loss, high power characteristics suitable for high voltage and high current application field, including electric vehicles, electric vehicle charging infrastructure, solar energy and offshore wind power and other green power generation equipment.ompared with traditional Si, the third-generation semiconductor material SiC can reduce the power conversion loss by 50%, reduce the power conversion cost by 20%, and improve the endurance of electric vehicles by 4%.
4inch & 6 inch SiC Wafer Manufacturer-New Energy Vehicles Applications
Ultrafast Laser Vertical Modification Of SiC Single Crystal Materials
P-type SiC Wafer Manufacturer Low Resistance High Doping
Detailed Explanation SiC Wafer Processing Technology
Contact: Mr.Kimrui
Phone: 15366208370
Tel: 15366208370
Email: kim@homray-material.com
Add: LiSheng Industrial Building, 60SuLi Road, WuZhong District, JiangSu Province, P.R.China.