4 inch SiC Boule Single Crystal

HMT company foucs on fabricate Diameter 100mm 4 inch SiC Boule/Ingot for laser cutting(cold split,water laser slicing), wire sawing, granding wheel and lapping plate machine's testing. We have D grade and P grade, actually 2 inch 4 inch, 6 inch and 8 inch Single cyrstal SiC boules all available in HMT. The average thickness of SiC Boue/Ingot about 15-20mm per PCS. We always provide bottom price for our customers.

At present, SiC Boule slicing methods mainly include consolidated abrasive cutting, free abrasive slicing, laser cutting, cold separation and electric spark slicing.